What is LED Package (High Power)
An LED Package (High Power) is a packaging technology for high-power LED chips. This technology, known as Chip On Board (COB), involves directly attaching the LED chip to a Printed Circuit Board (PCB) using glue or solder, with the electrical connection established through wire bonding. The PCB can be made of low-cost FR-4 material or high thermal conductivity materials like aluminum substrates or copper clad ceramic substrates.
COB technology is primarily employed for packaging high-power multi-chip arrays, allowing for the integration of multiple LED chips within a single package. This integration enhances brightness while reducing the required input current for each individual LED chip, resulting in improved efficiency. Additionally, COB packages feature a larger heat dissipation area, facilitating better heat transfer to the housing and, consequently, lower thermal resistance and enhanced overall performance.
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Compared to alternative packaging technologies like Surface Mount Device (SMD), COB technology offers advantages such as higher power density, lower thermal resistance (typically 6-12W/mK), and improved cost-effectiveness. As a result, it is considered the mainstream direction for future luminaire design, offering high efficiency, good light quality, and cost savings.
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